US 12,087,780 B2
Optical sensor device and method for manufacturing an optical sensor device
Franz Lechner, Eindhoven (NL)
Assigned to AMS INTERNATIONAL AG, Jona (CH)
Appl. No. 17/288,316
Filed by ams International AG, Jona (CH)
PCT Filed Sep. 27, 2019, PCT No. PCT/EP2019/076278
§ 371(c)(1), (2) Date Apr. 23, 2021,
PCT Pub. No. WO2020/083606, PCT Pub. Date Apr. 30, 2020.
Claims priority of application No. 18202693 (EP), filed on Oct. 25, 2018.
Prior Publication US 2021/0375958 A1, Dec. 2, 2021
Int. Cl. H01L 27/144 (2006.01); H01L 31/0216 (2014.01)
CPC H01L 27/1443 (2013.01) [H01L 31/02164 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An optical sensor device, comprising:
a semiconductor body having a light-sensitive area;
metal layers arranged above the light-sensitive area and comprising an upper metal layer and a lower metal layer, the upper metal layer located at a greater distance from the light-sensitive area than the lower metal layer;
an aperture opening in the metal layers above the light-sensitive area;
a via structure arranged outside the aperture opening and interconnecting the metal layers and/or the semiconductor body;
wherein
the via structure is arranged in such a fashion that any straight line that is parallel to the light-sensitive area and traverses the aperture opening between the light-sensitive area and the upper metal layer is limited in both of its opposite directions by the via structure.