US 12,087,742 B2
Film pattern and methods for forming the same
Ying-Chieh Chen, Taoyuan (TW)
Assigned to SKIILEUX ELECTRICITY INC., Taoyuan (TW)
Filed by Skiileux Electricity Inc., Taoyuan (TW)
Filed on Nov. 5, 2021, as Appl. No. 17/520,373.
Claims priority of application No. 110105699 (TW), filed on Feb. 19, 2021.
Prior Publication US 2022/0271016 A1, Aug. 25, 2022
Int. Cl. H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01)
CPC H01L 25/0753 (2013.01) [H01L 33/505 (2013.01); H01L 33/54 (2013.01); H01L 33/507 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/005 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method for forming a film pattern on a substrate, comprising:
providing a substrate comprising a surface on which a film pattern is to be formed;
providing a pattern material containing a hot-melt glue;
providing a mask, wherein the mask comprises a light-transmitting portion and a light-non-transmitting portion, wherein the pattern material is between the substrate and the mask;
irradiating the mask using a light source capable of generating heat, wherein light generated by the light source passes through the light-transmitting portion, so that the pattern material under the light-transmitting portion is attached to the surface of the substrate by melting of the hot-melt glue; and
removing the mask and the pattern material under the light-non-transmitting portion.