US 12,087,728 B2
Systems and methods related to wire bond cleaning and wire bonding recovery
Aldrin Quinones Garing, Mexicali (MX); and Miguel Camargo Soto, Mexicali (MX)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by SKYWORKS SOLUTIONS, INC., Irvine, CA (US)
Filed on Apr. 4, 2022, as Appl. No. 17/712,963.
Application 17/712,963 is a continuation of application No. 15/294,551, filed on Oct. 14, 2016, granted, now 11,302,669.
Claims priority of provisional application 62/250,777, filed on Nov. 4, 2015.
Claims priority of provisional application 62/241,884, filed on Oct. 15, 2015.
Prior Publication US 2022/0336413 A1, Oct. 20, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01); H01L 21/02 (2006.01); H01L 21/48 (2006.01)
CPC H01L 24/98 (2013.01) [H01L 21/02068 (2013.01); H01L 21/4835 (2013.01); H01L 24/799 (2013.01); H01L 24/85 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for performing a semiconductor processing operation, comprising:
configuring a wire bonding machine such that the wire bonding machine performs customized cleaning movements with a capillary tool of the wire bonding machine, the configuring the wire bonding machine including configuring the capillary tool based on location-based parameters and pattern-based parameters relating to performing the customized cleaning movements, the pattern-based parameters defining one or more movements to etch contaminants with the capillary tool;
detecting one or more locations of a semiconductor device including the contaminants;
filtering out detected contaminants that are less than a predetermined size; and
etching the contaminants of at least the predetermined size over the one or more locations of the semiconductor device with the capillary tool, an etching pressure based on a speed of the customized cleaning movements of the capillary tool and a type of the contaminant.