US 12,087,726 B2
Device and method for joining substrates
Jürgen Burggraf, Schärding (AT)
Assigned to EV GROUP E. THALLNER GMBH, St. Florian am Inn (AT)
Appl. No. 17/642,046
Filed by EV Group E. Thallner GmbH, St. Florian am Inn (AT)
PCT Filed Nov. 8, 2019, PCT No. PCT/EP2019/080718
§ 371(c)(1), (2) Date Mar. 10, 2022,
PCT Pub. No. WO2021/089173, PCT Pub. Date May 14, 2021.
Prior Publication US 2024/0047414 A1, Feb. 8, 2024
Int. Cl. H01L 21/00 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01)
CPC H01L 24/80 (2013.01) [H01L 21/67121 (2013.01); H01L 2224/80091 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for bonding a first substrate to a second substrate at respective contact surfaces of the first and second substrates, said method comprising:
mounting the first substrate on a first mounting surface of a first substrate holder and mounting the second substrate on a second mounting surface of a second substrate holder, wherein the first and second substrate holders are arranged in a chamber;
contacting the respective contact surfaces of the first and second substrates at a bond initiation surface;
bonding the first substrate to the second substrate from a bond initiation surface to the centre of the first and second substrates; and
increasing a chamber pressure in the chamber:
(i) after the contacting of the respective contact surfaces of the first and second substrates at the bond initiation surface; and/or
(ii) during said bonding of the first substrate to the second substrate.