US 12,087,725 B2
Wire bonding apparatus, method for measuring opening amount of clamp apparatus, and method for calibrating clamp apparatus
Toshihiko Toyama, Tokyo (JP)
Assigned to SHINKAWA LTD., Tokyo (JP)
Appl. No. 17/603,584
Filed by SHINKAWA LTD., Tokyo (JP)
PCT Filed Sep. 4, 2020, PCT No. PCT/JP2020/033585
§ 371(c)(1), (2) Date Oct. 14, 2021,
PCT Pub. No. WO2022/049721, PCT Pub. Date Mar. 10, 2022.
Prior Publication US 2022/0310552 A1, Sep. 29, 2022
Int. Cl. B23K 20/00 (2006.01); H01L 23/00 (2006.01)
CPC H01L 24/78 (2013.01) [B23K 20/004 (2013.01); B23K 20/005 (2013.01); H01L 2224/78001 (2013.01); H01L 2224/78353 (2013.01); H01L 2224/78621 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A wire bonding apparatus, comprising:
a clamp apparatus, having a pair of arms;
a stage, moving the clamp apparatus in a horizontal direction;
a rod member;
a contact detection part, detecting contact between the rod member and the clamp apparatus; and
a control apparatus, controlling opening and closing of the pair of arms and an operation of the stage and acquiring position information of the clamp apparatus, wherein:
the control apparatus executes a first control to make an outer side surface of a first arm of the pair of arms contact the rod member in a state where the pair of arms are closed by moving the clamp apparatus, and acquires the position information of the clamp apparatus at a time of contacting the rod member,
executes a second control to make the outer side surface of the first arm contact the rod member in a state where the pair of arms are open by moving the clamp apparatus, and acquires the position information of the clamp apparatus at the time of contacting the rod member, and
executes a third control to obtain an opening amount of the pair of arms based on the position information of the clamp apparatus acquired in the first control and the second control.