US 12,087,724 B2
Palladium-coated copper bonding wire and method for manufacturing same
Hiroyuki Amano, Saga (JP); Yuki Antoku, Saga (JP); and Takeshi Kuwahara, Saga (JP)
Assigned to TANAKA DENSHI KOGYO K. K., Kanzaki-gun (JP)
Filed by TANAKA DENSHI KOGYO K. K., Saga (JP)
Filed on May 24, 2021, as Appl. No. 17/328,622.
Application 17/328,622 is a continuation of application No. PCT/JP2018/044294, filed on Nov. 30, 2018.
Claims priority of application No. 2018-220570 (JP), filed on Nov. 26, 2018.
Prior Publication US 2021/0280553 A1, Sep. 9, 2021
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/45 (2013.01) [H01L 24/43 (2013.01); H01L 24/05 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/43825 (2013.01); H01L 2224/43826 (2013.01); H01L 2224/43827 (2013.01); H01L 2224/45005 (2013.01); H01L 2224/45101 (2013.01); H01L 2224/45117 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45572 (2013.01); H01L 2224/45601 (2013.01); H01L 2224/45617 (2013.01); H01L 2224/45644 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/85045 (2013.01); H01L 2924/01016 (2013.01); H01L 2924/01034 (2013.01); H01L 2924/01052 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A palladium-coated copper bonding wire containing 50 mass ppm or less of sulfur group element in total, the palladium-coated copper bonding wire comprising:
a core material containing copper as a main component; and
a palladium layer on the core material, wherein
the sulfur group element includes at least one of:
5 mass ppm or more and 12 mass ppm or less of sulfur (S);
5 mass ppm or more and 20 mass ppm or less of selenium (Se); and
15 mass ppm or more and 50 mass ppm or less of tellurium (Te),
a concentration of palladium is 1.0 mass % or more and 4.0 mass % or less relative to the total of copper, palladium, and the sulfur group element of the palladium-coated copper bonding wire, and
a palladium-concentrated region in a free air ball formed at a tip of the palladium-coated copper bonding wire that has an average concentration of palladium of 6.5 atom % or more and 30.0 atom % or less relative to the total of copper and palladium that is within a range from a surface of a tip portion of the free air ball to 5.0 nm or more and 100.0 nm or less.