US 12,087,704 B2
Composite structure for image plane normalization of a microelectronic hybrid device
Thomas Sprafke, Huntsville, UT (US); Stephen Marinsek, Albuquerque, NM (US); and Christopher Cobb, Goleta, CA (US)
Assigned to Raytheon Company, Tewksbury, MA (US)
Filed by Raytheon Company, Waltham, MA (US)
Filed on Dec. 9, 2021, as Appl. No. 17/546,184.
Claims priority of provisional application 63/143,202, filed on Jan. 29, 2021.
Prior Publication US 2022/0246543 A1, Aug. 4, 2022
Int. Cl. H01L 23/00 (2006.01); G01J 3/02 (2006.01); H01L 23/34 (2006.01); H01L 23/36 (2006.01); H01L 23/40 (2006.01); H01L 27/146 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 23/34 (2013.01); H01L 23/36 (2013.01); H01L 27/14634 (2013.01); H01L 27/1469 (2013.01); G01J 3/0202 (2013.01); H01L 23/40 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A composite structure for image plane normalization of a microelectronic hybrid device, the composite structure comprising: a first surface; a second surface parallel to and spaced apart from the first surface; and a plurality of discrete pillars extending between the first and second surfaces, wherein at least some of the plurality of discrete pillars have a different coefficient of thermal expansion than at least some others of the plurality of discrete pillars.