US 12,087,700 B2
Embedded die microelectronic device with molded component
Srinivas Venkata Ramanuja Pietambaram, Chandler, AZ (US); Rahul N. Manepalli, Chandler, AZ (US); Praneeth Akkinepally, Tempe, AZ (US); Jesse C. Jones, Chandler, AZ (US); Yosuke Kanaoka, Phoenix, AZ (US); and Dilan Seneviratne, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Aug. 2, 2021, as Appl. No. 17/391,905.
Application 17/391,905 is a division of application No. 16/474,019, granted, now 11,081,448, issued on Aug. 3, 2021, previously published as PCT/US2017/024780, filed on Mar. 29, 2017.
Prior Publication US 2021/0366835 A1, Nov. 25, 2021
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01)
CPC H01L 23/5389 (2013.01) [H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 25/0652 (2013.01); H01L 23/5221 (2013.01); H01L 23/5381 (2013.01); H01L 24/16 (2013.01); H01L 2224/023 (2013.01); H01L 2224/0233 (2013.01); H01L 2224/16235 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming an embedded die package, comprising:
forming a substrate, the substrate defining multiple layers of conductive traces separated by respective layers of dielectric material;
placing an embedded die on a receiving surface of the substrate;
forming a molded component extending over a surface of the substrate and over at least a portion of the embedded die, the molded component formed with a planar outer surface independent of undulations at the surface of the substrate; and
forming multiple vertical contacts including:
a first group of vertical contacts extending though the molded component and arranged at a first pitch with respect to one another; and
a second group of contacts extending through the molded component and arranged at a second pitch with respect to one another, the second pitch smaller than the first pitch.