CPC H01L 23/5386 (2013.01) [H01L 25/072 (2013.01); H01L 23/49811 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/49175 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01)] | 20 Claims |
1. A power module providing a half bridge, the power module comprising:
at least one substrate comprising an inner load track, two intermediate load tracks and two outer load tracks, each of which load tracks is elongated and extends substantially across the at least one substrate in a first direction;
wherein the two intermediate load tracks are arranged adjacent to the inner load track, and each outer load track is arranged on the opposite side of one of the two intermediate load tracks with respect to a second direction substantially orthogonal to the first direction;
wherein the power module comprises two first sets of semiconductor switches, each first set of semiconductor switches being mounted on the inner load track and electrically connected to an intermediate load track, such that the first sets of semiconductor switches form a first arm of the half bridge;
wherein the power module comprises two second sets of semiconductor switches, each second set of semiconductor switches being mounted on an intermediate load track and electrically connected to an outer load track, such that the second sets of semiconductor switches form a second arm of the half bridge.
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