US 12,087,689 B2
Selectable monolithic or external scalable die-to-die interconnection system methodology
Sanjay Dabral, Cupertino, CA (US); Jun Zhai, Cupertino, CA (US); Jung-Cheng Yeh, Sunnyvale, CA (US); Kunzhong Hu, Cupertino, CA (US); Raymundo Camenforte, San Jose, CA (US); and Thomas Hoffmann, Los Gatos, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Oct. 17, 2023, as Appl. No. 18/488,561.
Application 18/488,561 is a division of application No. 17/483,535, filed on Sep. 23, 2021, granted, now 11,862,557.
Prior Publication US 2024/0047353 A1, Feb. 8, 2024
Int. Cl. H01L 21/00 (2006.01); H01L 23/48 (2006.01); H01L 23/528 (2006.01); H01L 23/538 (2006.01); H01L 23/58 (2006.01); H01L 25/065 (2023.01); H01L 21/66 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/528 (2013.01) [H01L 23/481 (2013.01); H01L 23/5386 (2013.01); H01L 23/585 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 21/78 (2013.01); H01L 22/20 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/30 (2013.01); H01L 24/32 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/30181 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A multi-die structure including:
a routing layer including a first package-level bond pad, a second package-level bond pad, and a package-level die-to-die routing electrically connecting the first package-level bond pad to the second package-level bond pad;
a first die bonded to a first side of the routing layer and in electrical connection with the first package-level bond pad; and
a second die bonded to the first side of the routing layer and in electrical connection with the second package-level bond pad;
wherein the first die includes:
a first front-end-of-the-line (FEOL) die area including a communication device selected from the group consisting of a transceiver and a receiver; and
a first back-end-of-the-line (BEOL) build-up structure spanning over the first FEOL die area, the first BEOL build-up structure including an intra-chip routing connected to the communication device, and a chip-level die-to-die routing connecting the communication device to a first bond pad of the first BEOL build-up structure, wherein the first bond pad is bonded to the routing layer and electrically connected to the first package-level bond pad.