US 12,087,678 B2
Electronic molded package
Frans Meeuwsen, Nijmegen (NL); and Jurgen Raben, Nijmegen (NL)
Assigned to Ampleon Netherlands B.V., Nijmegen (NL)
Appl. No. 17/440,268
Filed by Ampleon Netherlands B.V., Nijmegen (NL)
PCT Filed Mar. 18, 2020, PCT No. PCT/NL2020/050180
§ 371(c)(1), (2) Date Sep. 17, 2021,
PCT Pub. No. WO2020/190137, PCT Pub. Date Sep. 24, 2020.
Claims priority of application No. 2022759 (NL), filed on Mar. 18, 2019.
Prior Publication US 2022/0157699 A1, May 19, 2022
Int. Cl. H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01); H01L 23/66 (2006.01)
CPC H01L 23/49562 (2013.01) [H01L 23/053 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 2223/6611 (2013.01); H01L 2224/48151 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A molded cavity electronic package, comprising:
a substrate;
a plurality of leads, each lead being spaced apart from the substrate;
a body of a solidified molding compound directly and fixedly attached to the substrate and the plurality of leads;
a lid that is fixedly connected to the body, wherein a space surrounded by the lid, body and substrate defines a cavity in which an electronic component is arranged;
wherein each respective lead among the plurality of leads penetrates the body from an inside of the package to an outside of the package;
wherein each respective lead among the plurality of leads comprises:
an inner part that extends within the inside of the package and that is substantially free of molding compound to allow one or more bondwires to be bonded thereto;
a body part that extends within the body; and
an outer part that extends on the outside of the package and that is substantially free of molding compound;
wherein the electronic component comprises a semiconductor die mounted to the substrate and a plurality of bondwires extending between the semiconductor die and the inner parts;
wherein, for each respective lead among the plurality of leads:
a width (w1) of a lead end portion of the outer part is substantially smaller than a width (w5) of the inner part;
the outer part comprises at least a clamping portion arranged directly adjacent the body part and having two sides, the clamping portion being adapted to be clamped on both sides by a mold;
the thickness of the respective lead lies in the range between 0.1 mm and 0.35 mm;
a width (w3) of the clamping portion is at least 1.1 times larger than the width of the lead end portion of the outer part;
the width of the inner part lies in the range between 0.75 and 8 mm; the width of the lead end portion of the outer part is larger than 0.25 mm;
the width (w3) of the clamping portion, the width (w4) of the body part, and the width (w5) of the inner part are each identical.