US 12,087,676 B2
Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof
Jae Min Bae, Seoul (KR); Hyung Jun Cho, Incheon (KR); and Seung Woo Lee, Incheon (KR)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Valley Point (SG)
Filed on Jul. 3, 2023, as Appl. No. 18/217,795.
Application 18/217,795 is a continuation of application No. 17/328,861, filed on May 24, 2021, granted, now 11,694,946, issued on Jul. 4, 2023.
Prior Publication US 2023/0352374 A1, Nov. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2023.01); H01L 25/07 (2006.01)
CPC H01L 23/49555 (2013.01) [H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/4951 (2013.01); H01L 23/4952 (2013.01); H01L 23/49524 (2013.01); H01L 23/49541 (2013.01); H01L 23/49551 (2013.01); H01L 23/49575 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 25/072 (2013.01); H01L 2924/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of manufacturing a semiconductor device, comprising:
providing a substrate comprising leads, the leads comprising:
lead terminals each comprising an outer side, an inner side opposite to the outer side, and a lower side connecting the outer side to the inner side;
lead steps; and
lead offsets extending between the lead steps so that at least some lead steps reside on different planes;
coupling a first electronic component to a first lead step of the lead steps;
coupling a second electronic component to a second lead step of the lead steps; and
providing an encapsulant encapsulating the first electronic component, the second electronic component, and portions of the substrate,
wherein:
the lead terminals each downwardly extend from a bottom side of an outermost lead step of the leads;
the lower sides of the lead terminals are exposed from a first side of the encapsulant; and
the encapsulant encapsulates the inner sides of the lead terminals.