US 12,087,674 B2
Spring bar leadframe, method and packaged electronic device with zero draft angle
Lee Han Meng@Eugene Lee, Kuala Lumpur (MY); Anis Fauzi Bin Abdul Aziz, Melaka (MY); Sueann Wei Fen Lim, Melaka (MY); and Jin Keong Lim, Kuala Lumpur (MY)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Mar. 1, 2022, as Appl. No. 17/683,768.
Application 17/683,768 is a continuation of application No. 16/892,527, filed on Jun. 4, 2020, granted, now 11,264,310.
Prior Publication US 2022/0223503 A1, Jul. 14, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49541 (2013.01) [H01L 21/4825 (2013.01); H01L 21/4842 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3121 (2013.01); H01L 23/49513 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
attaching first semiconductor dies to respective first die attach pads of first device portions of respective first columns of a lead frame;
attaching second semiconductor dies to respective second die attach pads of second device portions of respective second columns of the lead frame, the lead frame including rows that extend along a first direction and the first and second columns extend along a second direction, the first direction being perpendicular to the second direction;
covering the first semiconductor dies of each respective first column in a single respective first package structure;
covering the second semiconductor dies of each respective second column in a single respective second package structure;
cutting the lead frame along trim lines to separate respective first and second lead portions of adjacent ones of the first and second columns of the lead frame, the trim lines being parallel to the second direction;
moving the first columns along the second direction relative to the second columns; and
performing a cutting process that cuts through the lead frame and the first and second package structures along cut lines between the first device portions of the respective first columns and between the second device portions of the respective second columns, the cut lines being parallel to the first direction.