US 12,087,670 B1
Metal substrates with structures formed therein and methods of making same
Chad B. Moore, Albany, NY (US); Graeme F. Housser, Albany, NY (US); and Shane T. McMahon, Albany, NY (US)
Assigned to LUX SEMICONDUCTORS, INC.
Filed by LUX SEMICONDUCTORS, INC., Albany, NY (US)
Filed on Aug. 9, 2023, as Appl. No. 18/446,841.
Int. Cl. H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/492 (2006.01)
CPC H01L 23/4922 (2013.01) [H01L 21/4803 (2013.01); H01L 21/4878 (2013.01); H01L 23/4924 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A metal substrate comprising:
a substrate body consisting of a metal;
at least one in-substrate structure (ISS) formed of the same metal as the metal substrate body and extending into the metal substrate such that ends of the at least one in-substrate structure terminate at a respective plane or planes of surfaces of the metal substrate; and
a dielectric material disposed between the metal substrate and the at least one in-substrate structure to isolate the at least one in-substrate structure from the metal substrate.