US 12,087,652 B2
Semiconductor package device and method of manufacturing the same
Yi Chen, Kaohsiung (TW); Chang-Lin Yeh, Kaohsiung (TW); and Jen-Chieh Kao, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Aug. 9, 2022, as Appl. No. 17/884,515.
Application 17/884,515 is a continuation of application No. 16/751,139, filed on Jan. 23, 2020, granted, now 11,410,899.
Application 16/751,139 is a continuation of application No. 15/884,313, filed on Jan. 30, 2018, granted, now 10,580,713.
Claims priority of provisional application 62/456,553, filed on Feb. 8, 2017.
Prior Publication US 2022/0384289 A1, Dec. 1, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/10 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01Q 13/10 (2006.01); H01Q 19/10 (2006.01); H01Q 21/06 (2006.01)
CPC H01L 23/3114 (2013.01) [H01L 23/10 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 23/66 (2013.01); H01L 24/13 (2013.01); H01L 24/73 (2013.01); H01L 24/85 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/2291 (2013.01); H01Q 13/10 (2013.01); H01Q 19/10 (2013.01); H01Q 21/061 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15321 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A semiconductor package device, comprising:
a first substrate;
a second substrate;
a stand-off structure comprising a spacer and a connection layer, the stand-off structure disposed between the first substrate and the second substrate; and
an electronic component disposed under the second substrate and electrically connected to an antenna element, wherein the electronic component and the stand-off structure overlap in a cross-sectional view.