US 12,087,623 B1
Dielectric liners on through glass vias
Ramakanth Alapati, Dallas, TX (US); M Ziaul Karim, San Jose, CA (US); and Christopher Lane, Los Gatos, CA (US)
Assigned to YIELD ENGINEERING SYSTEMS, INC., Fremont, CA (US)
Filed by Yield Engineering Systems, Inc., Fremont, CA (US)
Filed on Jan. 25, 2024, as Appl. No. 18/422,346.
Int. Cl. H01L 21/768 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 23/538 (2006.01)
CPC H01L 21/76831 (2013.01) [H01L 21/76822 (2013.01); H01L 23/49894 (2013.01); H01L 23/5329 (2013.01); H01L 23/15 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5226 (2013.01); H01L 23/5384 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of improving interfacial adhesion of a copper-glass interface in a Through Glass Via (TGV) of an electronic device, comprising:
providing a glass substrate with a plurality of TGVs formed thereon;
forming a coating of a curable polymer material on an internal wall of a TGV of the plurality of TGVs, wherein a viscosity of the curable polymer material is less than 30 Poise;
curing the coating of the curable polymer material to form a dielectric liner having a tensile strength greater than about 8 Mpa and a dielectric loss less than about 0.002; and
depositing a layer of copper on the dielectric liner.