US 12,087,613 B2
Wafer placement table and method of manufacturing the same
Hiroshi Takebayashi, Handa (JP); Kenichiro Aikawa, Handa (JP); and Tatsuya Kuno, Nagoya (JP)
Assigned to NGK INSULATORS, LTD., Nagoya (JP)
Filed by NGK INSULATORS, LTD., Nagoya (JP)
Filed on Dec. 10, 2021, as Appl. No. 17/643,600.
Application 17/643,600 is a continuation of application No. PCT/JP2020/022830, filed on Jun. 10, 2020.
Claims priority of application No. 2019-121487 (JP), filed on Jun. 28, 2019.
Prior Publication US 2022/0102186 A1, Mar. 31, 2022
Int. Cl. B23Q 3/15 (2006.01); C23C 4/02 (2006.01); C23C 4/134 (2016.01); H01L 21/687 (2006.01)
CPC H01L 21/6875 (2013.01) [C23C 4/02 (2013.01); C23C 4/134 (2016.01); H01L 21/68757 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A wafer placement table which is a ceramic sintered body with a surface provided with multiple projections that support a wafer,
wherein of the surface of the ceramic sintered body, an area provided with no projection is a mirror surface which has a surface roughness Ra of 0.1 μm or less, and
the projections are formed of an aerosol deposition film or a thermal spray film made of the same material as for the ceramic sintered body, and
wherein the projections have a denseness lower than a denseness of the ceramic sintered body.