US 12,087,611 B2
Semiconductor processing tool and methods of operation
Chung-Pin Chou, Hsinchu (TW); Kai-Lin Chuang, Chia-Yi (TW); Sheng-Wen Huang, Taichung (TW); Yan-Cheng Chen, Taichung (TW); and Jun Xiu Liu, Taichung (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jul. 26, 2023, as Appl. No. 18/359,281.
Application 18/359,281 is a continuation of application No. 17/651,690, filed on Feb. 18, 2022, granted, now 11,764,094.
Prior Publication US 2023/0369092 A1, Nov. 16, 2023
Int. Cl. H01T 23/00 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/6833 (2013.01) 20 Claims
OG exemplary drawing
 
15. A system, comprising:
a controller configured to:
determine that a condition associated with electrical arcing, between a topside surface of a semiconductor substrate positioned above an electrode and a component of a semiconductor processing tool, has occurred; and
transmit, based on determining that the condition has occurred:
a first signal to position one or more tips of one or more electrically-conductive pins near or through exits of one or more pin-guides; and
a second signal to adjust a power setting so that the one or more electrically-conductive pins transfer an electrical charge to or from the semiconductor substrate to change an electrical potential of a region of the semiconductor substrate including the topside surface.