US 12,087,602 B2
Wafer cleaning method
Kuo-Shu Tseng, New Taipei (TW); Yao-Yuan Shang, Taichung (TW); and You-Feng Chen, Taichung (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jul. 13, 2023, as Appl. No. 18/351,566.
Application 16/725,459 is a division of application No. 14/163,045, filed on Jan. 24, 2014, granted, now 10,515,833, issued on Dec. 24, 2019.
Application 18/351,566 is a continuation of application No. 16/725,459, filed on Dec. 23, 2019, granted, now 11,742,227.
Prior Publication US 2023/0360938 A1, Nov. 9, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); B08B 1/00 (2006.01); H01L 21/02 (2006.01)
CPC H01L 21/67253 (2013.01) [H01L 21/67046 (2013.01); B08B 1/00 (2013.01); H01L 21/0209 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A wafer cleaning method for cleaning contaminants on a wafer, wherein a backside of the wafer has a clear area and an unclear area, and the contaminants are located in the unclear area, the wafer cleaning method comprising:
inspecting the backside of the wafer and generating an inspection signal by an inspection device;
generating a control signal according to the inspection signal by a process module, wherein the control signal includes movement information of a brush element according to coordinates of the contaminants obtained from the inspection signal; and
controlling the brush element to clean the contaminants on the backside of the wafer according to the control signal by a control device along a predetermined path.