US 12,087,594 B2
Colored gratings in microelectronic structures
Gurpreet Singh, Portland, OR (US); Eungnak Han, Portland, OR (US); Manish Chandhok, Beaverton, OR (US); Richard E Schenker, Portland, OR (US); Florian Gstrein, Portland, OR (US); Paul A. Nyhus, Portland, OR (US); and Charles Henry Wallace, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by INTEL CORPORATION, Santa Clara, CA (US)
Filed on Dec. 17, 2020, as Appl. No. 17/124,730.
Prior Publication US 2022/0199420 A1, Jun. 23, 2022
Int. Cl. H01L 21/311 (2006.01); H01L 21/768 (2006.01)
CPC H01L 21/31144 (2013.01) [H01L 21/76811 (2013.01); H01L 21/76816 (2013.01); H01L 21/76831 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A microelectronic structure, comprising:
a metallization layer including a conductive structure;
a first unordered lamellar region laterally spaced apart from and aligned with a bottom portion of the conductive structure; and
a second unordered lamellar region above the first unordered lamellar region, wherein the second unordered lamellar region is laterally spaced apart from and aligned with a top portion of the conductive structure.