US 12,087,560 B2
Apparatus and method for treating substrate
Dukhyun Son, Cheonan-si (KR); and Byung Kyu Kim, Seoul (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Mar. 30, 2021, as Appl. No. 17/216,972.
Application 17/216,972 is a division of application No. 16/793,028, filed on Feb. 18, 2020, granted, now 11,295,936.
Claims priority of application No. 10-2019-0020653 (KR), filed on Feb. 21, 2019.
Prior Publication US 2021/0217594 A1, Jul. 15, 2021
Int. Cl. H01J 37/32 (2006.01); B25J 11/00 (2006.01); H01L 21/3065 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01)
CPC H01J 37/32743 (2013.01) [B25J 11/005 (2013.01); H01J 37/32642 (2013.01); H01L 21/3065 (2013.01); H01L 21/67069 (2013.01); H01L 21/67766 (2013.01); H01L 21/67769 (2013.01); H01L 21/67778 (2013.01); H01L 21/68707 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An apparatus for treating a substrate, the apparatus comprising:
a processing module configured to treat the substrate; and
an index module on which a cassette having the substrate received therein is placed, the index module including an index robot configured to transfer the substrate between the cassette and the processing module,
wherein the processing module includes,
a process chamber configured to treat the substrate using plasma, and
a transfer chamber having a main transfer robot installed therein, the main transfer robot being configured to transfer the substrate into the process chamber,
wherein the process chamber includes,
a housing having a processing space therein,
a support unit configured to support the substrate in the processing space,
a gas supply configured to supply a process gas into the processing space, and
a plasma source configured to generate plasma from the process gas, wherein the support unit includes,
a support configured to support the substrate to be placed thereon, and
a ring member configured to surround the substrate placed on the support and to be detachable from the support, and
wherein the apparatus further comprises a carrier storage configured to store a carrier including a body and an anti-slip member on the body, the anti-slip member configured to make direct contact with the ring member to be placed thereon, and
the main transfer robot or the index robot comprises a hand including vacuum holes and configured to mount the body thereon, the hand configured to clamp and support the substrate or the body by vacuum pressure in the vacuum holes.