US 12,087,547 B2
Device for multi-level pulsing, substrate processing apparatus including the same
Goon Ho Park, Seoul (KR); Jung Mo Gu, Gyeonggi-do (KR); Ja Myung Gu, Chungcheongnam-do (KR); and Hyun Jin Kim, Daegu (KR)
Assigned to SEMES CO. LTD., Chungcheongnam-do (KR)
Filed by SEMES Co., Ltd., Chungcheongnam-do (KR)
Filed on Nov. 22, 2021, as Appl. No. 17/532,082.
Claims priority of application No. 10-2020-0161997 (KR), filed on Nov. 27, 2020.
Prior Publication US 2022/0172927 A1, Jun. 2, 2022
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32183 (2013.01) [H01J 37/32146 (2013.01); H01J 37/3244 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An apparatus for multi-level pulsing comprising:
an RF signal generator for generating an RF signal including a first pulsing level and a second pulsing level that are different from each other; and
a matching network for receiving the RF signal and providing a corresponding output signal to a load,
wherein the RF signal generator generates an RF signal so that a first target impedance of the first pulsing level and a second target impedance of the second pulsing level are different from each other,
wherein the matching network includes at least one tunable component,
wherein in order to reduce reflected power associated with the RF signal of the first pulsing level, the first target impedance in the RF signal generator is not adjusted, and operating parameters of the at least one tunable component of the matching network are adjusted,
wherein in order to reduce reflected power associated with the RF signal of the second pulsing level, the operating parameters of the tunable component of the matching network are not adjusted, and the second target impedance in the RF signal generator is adjusted.