US 12,087,512 B2
Electronic component and board having the same
Gyeong Ju Song, Suwon-si (KR); Beom Joon Cho, Suwon-si (KR); and Seung Min Ahn, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on May 11, 2023, as Appl. No. 18/196,257.
Application 18/196,257 is a continuation of application No. 17/333,817, filed on May 28, 2021, granted, now 11,749,460.
Claims priority of application No. 10-2020-0140954 (KR), filed on Oct. 28, 2020.
Prior Publication US 2023/0282422 A1, Sep. 7, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 2/065 (2013.01); H01G 4/012 (2013.01); H01G 4/1209 (2013.01); H01G 4/232 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An electronic component comprising:
a capacitor body;
a pair of external electrodes disposed on opposite ends of the capacitor body, respectively; and
a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively;
wherein a bottom surface of one of the pair of mounting portions has roughness greater than that of an upper surface of the one of the pair of mounting portions, and
the bottom surface of the one mounting portion has a mesh pattern.