US 12,087,510 B2
Multilayer capacitor
Hwi Dae Kim, Suwon-si (KR); Won Chul Sim, Suwon-si (KR); Taek Jung Lee, Suwon-si (KR); Jin O Yoo, Suwon-si (KR); and Young Ghyu Ahn, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jun. 14, 2022, as Appl. No. 17/840,000.
Claims priority of application No. 10-2021-0122914 (KR), filed on Sep. 15, 2021.
Prior Publication US 2023/0091278 A1, Mar. 23, 2023
Int. Cl. H01G 4/30 (2006.01); C04B 35/468 (2006.01); C04B 35/64 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/30 (2013.01) [C04B 35/468 (2013.01); C04B 35/64 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/232 (2013.01); C04B 2235/3206 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multilayer capacitor comprising:
a body including a dielectric layer and first and second internal electrodes stacked on each other and having the dielectric layer interposed therebetween;
a pair of first external electrodes respectively disposed on first and second corners of the body, which are not adjacent to each other, and connected to the first internal electrode;
a pair of second external electrodes respectively disposed on third and fourth corners of the body, which are not adjacent to each other, and connected to the second internal electrode; and
a reinforcing portion disposed on a surface of the body, not covered by at least one of the first and second external electrodes, and including a sintered ceramic body,
wherein the first and second external electrodes each includes a seed layer disposed on the first to fourth corners of the body.