US 12,087,509 B2
Multilayer ceramic capacitor
Gyu Ho Yeon, Suwon-si (KR); Won Kuen Oh, Suwon-si (KR); and Seo Won Jung, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 20, 2022, as Appl. No. 17/725,246.
Claims priority of application No. 10-2021-0181764 (KR), filed on Dec. 17, 2021.
Prior Publication US 2023/0197343 A1, Jun. 22, 2023
Int. Cl. H01G 4/06 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/2325 (2013.01) [H01G 4/30 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A multilayer ceramic capacitor comprising:
a body including a dielectric layer and internal electrodes and external electrodes disposed on one surface of the body,
wherein the external electrodes respectively include:
a first electrode layer connected to the internal electrodes and including copper (Cu);
a second electrode layer disposed on the first electrode layer and including silver (Ag) and palladium (Pd); and
a copper-palladium intermetallic compound formed at an interface between the first electrode layer and the second electrode layer,
wherein the second electrode layer includes a first layer and a second layer disposed sequentially adjacent to the first electrode layer, and the first layer has a content of palladium higher than a content of palladium of the second layer, and wherein the copper-palladium intermetallic compound is formed directly on the second electrode layer.