US 12,087,477 B2
Chip resistor
Yuusuke Yamamoto, Fukui (JP); and Ryusei Fujita, Fukui (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Appl. No. 17/755,584
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
PCT Filed Nov. 17, 2020, PCT No. PCT/JP2020/042745
§ 371(c)(1), (2) Date May 2, 2022,
PCT Pub. No. WO2021/106676, PCT Pub. Date Jun. 3, 2021.
Claims priority of application No. 2019-212330 (JP), filed on Nov. 25, 2019; and application No. 2020-067178 (JP), filed on Apr. 3, 2020.
Prior Publication US 2022/0367089 A1, Nov. 17, 2022
Int. Cl. H01C 1/14 (2006.01); H01C 1/032 (2006.01); H01C 7/00 (2006.01)
CPC H01C 1/14 (2013.01) [H01C 1/032 (2013.01); H01C 7/00 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A chip resistor comprising:
an insulating substrate having a rectangular shape and provided with a recess on an upper face;
a pair of upper-face electrodes provided on the upper face of the insulating substrate;
a resistance member provided on the insulating substrate and electrically connected to the pair of upper-face electrodes, the resistance member having a trimming groove;
a protective layer provided on the upper face of the insulating substrate to cover at least the resistance member;
an end-face electrode provided on an outer face in a longitudinal direction of the insulating substrate and electrically connected to the upper-face electrode; and
a lower-face electrode provided on a lower face of the insulating substrate and electrically connected to the end-face electrode,
wherein the resistance member is provided on both the upper face of the insulating substrate and an embedded portion embedded in the recess, and
wherein a length, in a lateral direction of the insulating substrate, of a first trimming groove provided in the resistance member provided in the embedded portion is larger than a length, in the lateral direction of the insulating substrate, of a second trimming groove provided in the resistance member provided on the upper face of the insulating substrate.