US 12,087,474 B2
Cable and antenna device with coaxial cable
Yoshitaka Yoshino, Kanagawa (JP); Makoto Makishima, Kanagawa (JP); and Taihei Satou, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 17/763,035
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Sep. 15, 2020, PCT No. PCT/JP2020/034917
§ 371(c)(1), (2) Date Mar. 23, 2022,
PCT Pub. No. WO2021/060075, PCT Pub. Date Apr. 1, 2021.
Claims priority of application No. 2019-173887 (JP), filed on Sep. 25, 2019.
Prior Publication US 2022/0344075 A1, Oct. 27, 2022
Int. Cl. H01B 7/26 (2006.01); H01B 7/18 (2006.01); H01B 11/18 (2006.01)
CPC H01B 7/26 (2013.01) [H01B 7/1875 (2013.01); H01B 11/1808 (2013.01); H01B 11/1895 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A cable comprising:
a first shield portion that surrounds at least one or more lines for transmitting a signal or electric power and that is provided on an outer side of the lines;
a first layer that is provided in such a manner as to cover an outer circumference of the first shield portion and that includes resin that absorbs radio waves;
a second shield portion that is provided on an outer side of the first layer;
a second layer that is provided in such a manner as to cover an outer circumference of the second shield portion and that includes resin that absorbs radio waves; and
insulating resin that covers an outer side of the second layer,
wherein the resin includes a mixture of ferrite powder in resin including PVC or elastomer,
wherein, in the resin of the first layer and the resin of the second layer, a ratio of the ferrite powder to the resin is equal to or higher than 70% but equal to or lower than 98% in weight ratio to the resin, and
wherein the first shield portion is grounded and the second shield portion is not grounded.