	US 12,087,464 B2
	Method for manufacturing conductive paste and method for manufacturing multilayer ceramic electronic component
Tae Gyun Kwon, Suwon-si (KR); and Eung Seok Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 15, 2022, as Appl. No. 17/721,839.
Claims priority of application No. 10-2022-0016323 (KR), filed on Feb. 8, 2022.
Prior Publication US 2023/0253131 A1, Aug. 10, 2023
Int. Cl. H01B 1/20 (2006.01); C09J 9/02 (2006.01); H01B 1/02 (2006.01); H01B 1/22 (2006.01); H01G 4/30 (2006.01)

CPC H01B 1/22 (2013.01) [H01B 1/02 (2013.01); H01G 4/302 (2013.01)]

28 Claims

1. A method for manufacturing a conductive paste, comprising:

preparing a first solution including a metal particle and a first solvent;

preparing a second solvent;

preparing a surfactant including a core particle and an organic material bonded to a surface of the core particle; and

mixing the first solution, the second solvent, and the surfactant to form a mixed solution,

wherein one solvent among the first solvent and the second solvent is a hydrophobic solvent, and the other solvent is a hydrophilic solvent.