US 12,087,336 B1
Tape heads having shifted array/pad arrangements
Robert G. Biskeborn, Hollister, CA (US); David J. Seagle, Morgan Hill, CA (US); Diane L. Brown, San Jose, CA (US); Trevor W. Olson, San Jose, CA (US); and Michael T. Babin, Sr., Saratoga, CA (US)
Assigned to Western Digital Technologies, Inc., San Jose, CA (US)
Filed by Western Digital Technologies, Inc., San Jose, CA (US)
Filed on Sep. 19, 2023, as Appl. No. 18/370,273.
Int. Cl. G11B 5/48 (2006.01); G11B 5/008 (2006.01); G11B 5/592 (2006.01)
CPC G11B 5/4893 (2013.01) [G11B 5/00813 (2013.01); G11B 5/5926 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A tape head module, comprising:
a chip;
a first data element array disposed on the chip, the first data element array comprising a first plurality of data elements;
a second data element array disposed on the chip, the second data element array comprising a second plurality of data elements; and
a plurality of pads coupled to the first plurality of data elements and to the second plurality of data elements, wherein the first data element array, the second data element array, and the plurality of pads are shifted, from a central axis of the chip, a distance of about one-half the span of either the first or second data element array in a first direction.