CPC G06F 30/327 (2020.01) [G05B 19/41865 (2013.01); G05B 19/41885 (2013.01)] | 20 Claims |
1. A method for setting wafer script, wherein
the method for setting wafer script is applicable to a manufacturing execution system, the manufacturing execution system comprises a demand unit, a set unit, a platform unit, and a material execution unit; the method comprises:
acquiring, by the platform unit, lot identification of script to be executed and corresponding production information, in response to the demand unit determining, based on parameter information, that execution necessary condition of the script to be executed satisfies business requirement, wherein the execution necessary condition is corresponding condition set by the set unit for the script to be executed according to the business requirement;
detecting, by the platform unit, whether first production information corresponding to first wafers satisfies the execution necessary condition, in response to the demand unit determining that the script to be executed is executed for wafers corresponding to the script to be executed for the first time, wherein the first wafers are selected by the demand unit and imported into the platform unit, for executing the script which to be executed for the first time; and
setting, by the platform unit, the parameter information and assignment information for the first wafers in response to the detecting result being satisfied, and synchronizing the first wafers with the set information to the material execution unit such that the material execution unit executes corresponding operation.
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