US 12,086,363 B2
Sensor devices having an acoustic coupling medium, and associated manufacturing methods
Klaus Elian, Alteglofsheim (DE); Christoph Steiner, St. Margarethen a. d. Raab (AT); and Horst Theuss, Wenzenbach (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Aug. 28, 2023, as Appl. No. 18/456,754.
Claims priority of application No. 102022122821.5 (DE), filed on Sep. 8, 2022.
Prior Publication US 2024/0086017 A1, Mar. 14, 2024
Int. Cl. G06F 3/043 (2006.01); B06B 1/02 (2006.01)
CPC G06F 3/0436 (2013.01) [B06B 1/0292 (2013.01); G06F 2203/04103 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A sensor device, comprising:
at least one sensor chip having a plurality of MEMS structures arranged at a main surface of the at least one sensor chip,
wherein the at least one sensor chip is configured to at least one of:
transmit ultrasonic signals, or
receive ultrasonic signals; and
an acoustic coupling medium arranged selectively on the a plurality of MEMS structures,
wherein the acoustic coupling medium is configured to at least one of:
decouple an ultrasonic signal to be emitted from the a plurality of MEMS structures, or
inject a received ultrasonic signal into the a plurality of MEMS structures, and
wherein the acoustic coupling medium only partially covers the main surface of the at least one sensor chip.