CPC G03F 7/70625 (2013.01) [G06T 7/001 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/30148 (2013.01)] | 20 Claims |
1. A method for determining shrinkage in resist of a substrate caused due to measurement via a metrology tool, the method comprising:
acquiring, from the metrology tool, a plurality of images of a pattern at a defined location on the substrate without a substrate alignment performed between captures of the images;
generating at least two data: (i) first data associated with the pattern using a first set of images of the plurality of images, and (ii) second data associated with the pattern using a second set of images of the plurality of images, wherein the first set of images comprises at least two consecutive images of the plurality of images, and the second set of images comprises at least two different consecutive images of the plurality of images; and
determining, by a hardware computer system and based on a difference between the first data and the second data, the shrinkage in the resist of the substrate.
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