US 12,085,840 B2
Camera assembly and electronic device
Sen Wang, Shenzhen (CN); Jian Shi, Shanghai (CN); Zhi Yuan, Shanghai (CN); Weidong Tang, Shenzhen (CN); Along Zhou, Yokohama (JP); and Chenhan Liu, Shenzhen (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., GuangDong (CN)
Filed on Jul. 22, 2022, as Appl. No. 17/871,533.
Application 17/871,533 is a continuation of application No. PCT/CN2021/070785, filed on Jan. 8, 2021.
Claims priority of application No. 202010075892.7 (CN), filed on Jan. 22, 2020.
Prior Publication US 2022/0357636 A1, Nov. 10, 2022
Int. Cl. G03B 17/55 (2021.01); G03B 30/00 (2021.01); H04N 23/52 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01)
CPC G03B 17/55 (2013.01) [G03B 30/00 (2021.01); H04N 23/52 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01)] 20 Claims
OG exemplary drawing
 
1. A camera assembly, comprising:
a rotatable camera module disposed on an auxiliary mount, and a flexible heat conducting assembly;
wherein the rotatable camera module comprises a camera function group disposed on a rotatable mount rotatably connected to the auxiliary mount, the flexible heat conducting assembly is fixedly connected to one end of the camera function group, and the flexible heat conducting assembly is further configured to be connected to a non-rotatable camera module component to transfer heat generated by the camera function group to the non-rotatable camera module component.