US 12,085,769 B2
Integrated circuit device and method
Yu-Hao Chen, Hsinchu (TW); and Hui Yu Lee, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Jul. 2, 2021, as Appl. No. 17/366,783.
Claims priority of provisional application 63/178,793, filed on Apr. 23, 2021.
Prior Publication US 2022/0342164 A1, Oct. 27, 2022
Int. Cl. G02B 6/42 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/538 (2006.01); H01L 25/16 (2023.01)
CPC G02B 6/4268 (2013.01) [G02B 6/4255 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/4871 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/367 (2013.01); H01L 23/3731 (2013.01); H01L 23/3732 (2013.01); H01L 23/3736 (2013.01); H01L 23/3738 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/167 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/214 (2013.01); H01L 2924/3511 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) device, comprising:
a heat spreader;
an electronic component over the heat spreader;
an optical component over the electronic component;
a multilayer structure over the optical component, the multilayer structure comprising a waveguide optically coupled to the optical component; and
a redistribution structure over the multilayer structure, and electrically coupled to the electronic component by vias through the optical component and the multilayer structure.