US 12,085,672 B2
Light-receiving element and distance-measuring module
Ryota Watanabe, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/250,340
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Jul. 4, 2019, PCT No. PCT/JP2019/026590
§ 371(c)(1), (2) Date Jan. 7, 2021,
PCT Pub. No. WO2020/017342, PCT Pub. Date Jan. 23, 2020.
Claims priority of application No. 2018-135396 (JP), filed on Jul. 18, 2018.
Prior Publication US 2021/0270940 A1, Sep. 2, 2021
Int. Cl. G01S 7/481 (2006.01); H01L 31/02 (2006.01); H01L 31/0216 (2014.01); H01L 31/0232 (2014.01)
CPC G01S 7/4811 (2013.01) [H01L 31/02005 (2013.01); H01L 31/02164 (2013.01); H01L 31/02327 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A light-receiving element, comprising:
an on-chip lens;
a wiring layer; and
a semiconductor layer between the on-chip lens and the wiring layer, wherein
the semiconductor layer includes:
a first voltage application portion configured to receive a first voltage,
a second voltage application portion configured to receive a second voltage different from the first voltage,
a first charge detection portion around the first voltage application portion, and
a second charge detection portion around the second voltage application portion,
an insulating film that covers each of the first voltage application portion and the second voltage application portion, and
a hole concentration strengthening layer on an outer periphery of the insulating film.