US 12,085,609 B1
Thermal control wafer with integrated heating-sensing elements
Carl L. Ostrowski, Milford, MI (US); Terry Sinclair Connacher, Tempe, AZ (US); Samer Kabbani, Laguna Niguel, CA (US); Enrique Aleman, Temecula, CA (US); Thomas P. Jones, Stanwood, MI (US); and Sorin Dinescu, Temecula, CA (US)
Assigned to AEM Singapore Pte. Ltd., Singapore (SG)
Filed by AEM Singapore Pte. Ltd., Singapore (SG)
Filed on Aug. 23, 2023, as Appl. No. 18/454,737.
Int. Cl. G01R 31/28 (2006.01)
CPC G01R 31/2875 (2013.01) 28 Claims
OG exemplary drawing
 
1. An apparatus for controlling one or more temperatures of a plurality of heater zones related to devices under test (DUTs), the apparatus comprising:
a thermal control wafer (TCW) comprising the plurality of heater zones, wherein the plurality of heaters zones is independently controllable and configured to heat the DUTs, wherein at least one of the plurality of heater zones has:
a heater-sensing element comprising a resistive trace that:
generates heat through Joule heating during a heating mode, and
provides a resistance during a sensing mode;
a coldplate disposed under the TCW, wherein the TCW is disposed below the DUTs; and
a thermal controller configured to determine a temperature of the at least one heater zone based on the resistance.