CPC G01R 1/07342 (2013.01) [G01R 3/00 (2013.01); G01R 31/2886 (2013.01); G01R 31/2887 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/0002 (2013.01)] | 11 Claims |
1. A probe chip, the probe chip comprising:
a substrate;
a plurality of probes made from a conductive material;
a first dielectric layer arranged adjacent to the substrate;
a seed layer arranged between the plurality of probes and the first dielectric layer;
wherein an angled portion of the plurality of probes is at an angle to the top surface of the substrate.
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