US 12,085,526 B2
Sensor device and electronic assembly
Matthias König, Munich (DE); Matthias Schmidt, Munich (DE); and Markus Mayr, Anzing (DE)
Assigned to TDK Corporation, Tokyo (JP)
Filed by TDK Corporation, Tokyo (JP)
Filed on Aug. 7, 2019, as Appl. No. 16/534,960.
Claims priority of application No. 102018119212.6 (DE), filed on Aug. 7, 2018.
Prior Publication US 2020/0049647 A1, Feb. 13, 2020
Int. Cl. G01N 27/16 (2006.01); G01N 31/10 (2006.01)
CPC G01N 27/16 (2013.01) [G01N 31/10 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A sensor device comprising:
a first pellistor element;
a second pellistor element;
a heater element;
a first temperature sensor element;
a second temperature sensor element,
wherein the heater element and the first temperature sensor element are part of the first pellistor element and the heater element and the second temperature sensor element are part of the second pellistor element;
a substrate carrying the first pellistor element and the second pellistor element; and
a membrane arranged on the substrate,
wherein the heater element is arranged in the membrane, and/or
wherein both the first temperature sensor element and the second temperature sensor element are arranged in or on the membrane,
wherein the first temperature sensor element and the second temperature sensor element are arranged in the same plane in or on the membrane, and
wherein the first and second temperature sensor elements are formed in an interlocking meandering shape.