US 12,085,333 B2
Semi-passive cooling using hierarchical vasculature
James T. Cahill, Livermore, CA (US); Swetha Chandrasekaran, Dublin, CA (US); Wyatt L. Du Frane, Livermore, CA (US); Joshua D. Kuntz, Livermore, CA (US); Richard L. Landingham, Livermore, CA (US); Ryan Lu, Daly City, CA (US); Christopher M. Spadaccini, Oakland, CA (US); Amy Wat, Oakland, CA (US); Seth E. Watts, Collingswood, NJ (US); and Marcus A Worsley, Hayward, CA (US)
Assigned to Lawrence Livermore National Security, LLC, Livermore, CA (US)
Filed by LAWRENCE LIVERMORE NATIONAL SECURITY, LLC, Livermore, CA (US)
Filed on Sep. 8, 2020, as Appl. No. 17/014,756.
Prior Publication US 2022/0074639 A1, Mar. 10, 2022
Int. Cl. F25D 7/00 (2006.01); F25D 3/00 (2006.01)
CPC F25D 7/00 (2013.01) [F25D 3/00 (2013.01); F25D 2303/08222 (2013.01); F25D 2303/084 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semi-passive cooling system for a component exposed to fluid flow and heat flux, comprising:
a body defining:
an outer surface,
a transpirant reservoir, and
a hierarchical vasculature communicating with, and extending from, the transpirant reservoir, and through at least a portion of the outer surface, to communicate with the outer surface of the body; and
a sacrificial transpirant disposed in the transpirant reservoir in a solid phase, wherein the transpirant is configured to transition between the solid phase and a vapor phase over an operating temperature range of the component.