US 12,084,599 B2
Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material
Emi Miyazawa, Tokyo (JP); Tsuyoshi Hayasaka, Tokyo (JP); Takashi Kawamori, Tokyo (JP); Shinichiro Sukata, Tokyo (JP); Yoshihito Inaba, Tokyo (JP); and Keisuke Nishido, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Filed by RESONAC CORPORATION, Tokyo (JP)
Filed on Oct. 18, 2023, as Appl. No. 18/381,288.
Application 18/381,288 is a division of application No. 16/767,908, granted, now 11,840,648, previously published as PCT/JP2018/044057, filed on Nov. 29, 2018.
Claims priority of application No. PCT/JP2017/043363 (WO), filed on Dec. 1, 2017.
Prior Publication US 2024/0093059 A1, Mar. 21, 2024
Int. Cl. C09J 4/06 (2006.01); B32B 7/12 (2006.01); B32B 17/06 (2006.01); B32B 37/12 (2006.01); B32B 43/00 (2006.01); C09J 7/30 (2018.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); H01L 21/683 (2006.01)
CPC C09J 4/06 (2013.01) [B32B 7/12 (2013.01); B32B 17/06 (2013.01); B32B 37/12 (2013.01); B32B 43/006 (2013.01); C09J 7/30 (2018.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); H01L 21/6835 (2013.01); B32B 2037/1253 (2013.01); B32B 2310/0825 (2013.01); C09J 2203/326 (2013.01); C09J 2203/37 (2020.08); C09J 2409/00 (2013.01); C09J 2433/00 (2013.01); H01L 2221/68381 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A laminated body for temporarily fixing a semiconductor member to a supporting member, the laminated body comprising:
a support member; and
a conductor layer formed from a conductor that generates heat upon absorbing light, provided on the support member,
wherein the supporting member is a glass substrate.