US 12,084,598 B2
Resin composition, adhesive member, and display device including the same
Tetsuya Fujiwara, Yokohama (JP)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-do (KR)
Filed by Samsung Display Co., Ltd., Yongin-si (KR)
Filed on Jul. 20, 2021, as Appl. No. 17/381,107.
Claims priority of application No. 10-2020-0166846 (KR), filed on Dec. 2, 2020.
Prior Publication US 2022/0169893 A1, Jun. 2, 2022
Int. Cl. C09J 4/06 (2006.01); B32B 7/12 (2006.01); B32B 17/10 (2006.01); B32B 27/06 (2006.01); C09J 133/06 (2006.01); G06F 3/041 (2006.01); G09F 9/30 (2006.01)
CPC C09J 4/06 (2013.01) [B32B 7/12 (2013.01); B32B 17/10 (2013.01); B32B 27/06 (2013.01); C09J 133/066 (2013.01); G06F 3/0412 (2013.01); G09F 9/301 (2013.01); B32B 2457/20 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A resin composition comprising:
at least one of a monofunctional (meth)acrylate having an imide ring structure or a monomer having a 2-pyrrolidone skeleton and a radical curable group in an amount of about 0.1 weight percent to about 5 weight percent based on the total weight of the resin composition:
a urethane (meth)acrylate oligomer, wherein the urethane (meth)acrylate oligomer is present in an amount of 2 weight percent to about 15 weight percent based on the total weight of the resin composition, and
at least one (meth)acrylate monomer having a molecular weight of about 100 g/mol to about 300 g/mol,
wherein the resin composition has a viscosity of about 5 millipascal seconds to less than about 50 millipascal seconds at 25° C.,
wherein a glass transition temperature of the resin composition after being cured is about −50° C. to less than about 0° C., and
wherein a 180° peel strength of the resin composition after being cured on glass or a polyimide film is about 1000 gram-force per 25 millimeter to about 2810 gram-force per 25 millimeter as determined at a temperature of 25° C. and a tensile rate of 300 millimeters per minute.