US 12,084,559 B2
Resin molded body
Ryuuji Matsumura, Nara (JP); Yuusuke Suenaga, Nara (JP); Takuya Masuda, Nara (JP); and Takafumi Akiyama, Nara (JP)
Assigned to SEKISUI TECHNO MOLDING CO., LTD., Tokyo (JP)
Appl. No. 16/492,074
Filed by SEKISUI TECHNO MOLDING CO., LTD., Tokyo (JP)
PCT Filed Apr. 23, 2018, PCT No. PCT/JP2018/016421
§ 371(c)(1), (2) Date Sep. 6, 2019,
PCT Pub. No. WO2018/199008, PCT Pub. Date Nov. 1, 2018.
Claims priority of application No. 2017-086953 (JP), filed on Apr. 26, 2017; and application No. 2017-189626 (JP), filed on Sep. 29, 2017.
Prior Publication US 2021/0108047 A1, Apr. 15, 2021
Int. Cl. H01B 1/24 (2006.01); C08K 3/04 (2006.01); C08L 23/06 (2006.01); C08K 3/08 (2006.01)
CPC C08K 3/042 (2017.05) [C08L 23/06 (2013.01); C08K 2003/0856 (2013.01)] 9 Claims
 
1. A resin molded body consisting of a thermoplastic resin, plate-like graphite, and carbon black,
the thermoplastic resin containing an olefin resin,
a content of the plate-like graphite being 150 parts by weight or more and 200 parts by weight or less, relative to 100 parts by weight of the thermoplastic resin,
the carbon black having a DBP oil absorption of 100 ml/100 g or more and 300 ml/100 g or less,
a content of the carbon black being 1 part by weight or more and 50 parts by weight or less, relative to 100 parts by weight of the thermoplastic resin,
the carbon black having a primary particle size of 34 nm or more and 50 nm or less, and
the resin molded body being a heat dissipation chassis or a heat dissipation case or having a heat sink shape.