US 12,084,546 B2
Thermosetting resin composition, film adhesive, prepreg, and production method thereof
Miki Horikawa, Osaka (JP); Takaya Suzuki, Osaka (JP); and Hiroaki Kuwahara, Osaka (JP)
Assigned to TEIJIN LIMITED, Osaka (JP)
Appl. No. 17/298,305
Filed by TEIJIN LIMITED, Osaka (JP)
PCT Filed Nov. 26, 2019, PCT No. PCT/JP2019/046183
§ 371(c)(1), (2) Date May 28, 2021,
PCT Pub. No. WO2020/111065, PCT Pub. Date Jun. 4, 2020.
Claims priority of application No. 2018-224300 (JP), filed on Nov. 29, 2018.
Prior Publication US 2022/0017698 A1, Jan. 20, 2022
Int. Cl. C08G 73/12 (2006.01); C08J 5/24 (2006.01); C08L 79/08 (2006.01); C09J 7/10 (2018.01); C09J 7/38 (2018.01)
CPC C08G 73/128 (2013.01) [C08J 5/243 (2021.05); C08J 5/244 (2021.05); C08J 5/249 (2021.05); C08L 79/085 (2013.01); C09J 7/10 (2018.01); C09J 7/38 (2018.01); C08J 2379/08 (2013.01); C09J 2400/12 (2013.01); C09J 2479/08 (2013.01)] 15 Claims
 
1. A thermosetting resin composition comprising a bismaleimide compound and a triazine compound,
wherein the triazine compound is selected from the following chemical formulas (12) to (14):

OG Complex Work Unit Chemistry
wherein in each of chemical formulas (12), (13), and (14), R is an aliphatic chain having 1 to 15 carbon atoms.