US 12,083,722 B2
Method for manufacturing film-formed molded product
Takao Umezawa, Gunma (JP); Hitoshi Konuma, Gunma (JP); and Mitsunori Sato, Gunma (JP)
Assigned to MITSUBA Corporation, Gunma (JP)
Appl. No. 17/420,715
Filed by MITSUBA Corporation, Gunma (JP)
PCT Filed Dec. 24, 2019, PCT No. PCT/JP2019/050500
§ 371(c)(1), (2) Date Jul. 5, 2021,
PCT Pub. No. WO2020/145123, PCT Pub. Date Jul. 16, 2020.
Claims priority of application No. 2019-003263 (JP), filed on Jan. 11, 2019.
Prior Publication US 2022/0105667 A1, Apr. 7, 2022
Int. Cl. B29C 45/16 (2006.01); B29C 45/00 (2006.01); B29C 45/04 (2006.01); B29C 45/06 (2006.01); B29C 45/14 (2006.01); C23C 14/34 (2006.01); C23C 14/50 (2006.01); B29L 9/00 (2006.01); B29L 31/34 (2006.01)
CPC B29C 45/162 (2013.01) [B29C 45/0053 (2013.01); B29C 45/0416 (2013.01); B29C 45/062 (2013.01); B29C 45/14778 (2013.01); B29C 45/1618 (2013.01); B29C 45/1635 (2013.01); B29C 45/1671 (2013.01); C23C 14/34 (2013.01); C23C 14/505 (2013.01); B29C 2045/0079 (2013.01); B29C 2045/1673 (2013.01); B29K 2995/0003 (2013.01); B29L 2009/008 (2013.01); B29L 2031/3456 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method for manufacturing a film-formed molded product which comprises a non-conductive first molded product and a metal coating film that covers the first molded product and has an electromagnetic wave transmission performance, comprising:
a process (a) in which a first mold and a second mold are mold-clamped, a first material is injected into a first space between the first mold and the second mold, and thereby the first molded product comprising the first material is formed;
a process (b) in which after the first mold and the second mold are mold-opened, the first molded product is moved with respect to the second mold between the first mold and the second mold; and
a process (c) in which after the process (b), the first mold and the second mold are mold-clamped, and the metal coating film is formed on a surface of the first molded product by a first film-forming part comprised in the second mold,
a process (c1) in which after the process (c), the first mold and the second mold are mold-opened, the first molded product is moved with respect to the second mold, the first mold and the second mold are mold-clamped at a second film-forming part formed adjacent to the first film-forming part, and a protective film made of aluminum oxide, magnesium fluoride or silicon oxide is formed on a surface of the metal coating film;
a process (d) in which after the process (c1), the first molded product, the metal coating film and the protective film are heated;
wherein cracks are generated on the metal coating film when temperatures of the first molded product, the metal coating film and the protective film are changed after the process (d), and thereby an electromagnetic wave transmission performance is imparted to the metal coating film and the protective film,
wherein the first film-forming part comprises a sputtering device,
a target disposed opposite to the first molded product for forming the metal coating film is curved or bent along a surface of the first molded product.