US 12,083,715 B2
Mold compound dispensing system and method
Xianlu Cui, Shanghai (CN); Junrong Yan, Shanghai (CN); C K Chin, Shanghai (CN); and Tao Shi, Shanghai (CN)
Assigned to Morgan, Lewis & Bockius LLP, San Jose, CA (US)
Filed by Western Digital Technologies, Inc., San Jose, CA (US)
Filed on Dec. 2, 2021, as Appl. No. 17/540,371.
Prior Publication US 2023/0173720 A1, Jun. 8, 2023
Int. Cl. B29C 43/58 (2006.01); B29C 41/18 (2006.01); B29C 43/18 (2006.01); G05B 19/4097 (2006.01); H01L 21/56 (2006.01); B29K 63/00 (2006.01); B29L 31/34 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01)
CPC B29C 43/58 (2013.01) [B29C 43/18 (2013.01); G05B 19/4097 (2013.01); H01L 21/561 (2013.01); B29C 2043/182 (2013.01); B29C 2043/5825 (2013.01); B29K 2063/00 (2013.01); B29L 2031/34 (2013.01); G05B 2219/45031 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06586 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of controlling a molding compound dispenser, comprising:
at a controller having one or more processors and memory storing instructions for execution by the one or more processors:
identifying, using an electronic input device communicatively coupled to the controller, a semiconductor device strip comprising a substrate having a plurality of segments allocated for die stacks;
obtaining topological data of the identified semiconductor device strip for each of the plurality of segments, wherein the topological data includes data indicative of any semiconductor components in each respective segment;
determining a mold cap of the identified semiconductor device strip;
determining an amount of molding compound to be applied to each of the plurality of segments based on the topological data for each respective segment and the mold cap; and
causing a molding compound dispenser to dispense the determined amounts of molding compound at each of the respective segments.