US 12,083,697 B2
Cutting device and method for cutting substrate using the same
Sehun Choi, Asan-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed by Samsung Display Co., LTD., Yongin-si (KR)
Filed on May 19, 2022, as Appl. No. 17/748,567.
Claims priority of application No. 10-2021-0140298 (KR), filed on Oct. 20, 2021.
Prior Publication US 2023/0119886 A1, Apr. 20, 2023
Int. Cl. B26D 1/24 (2006.01); B26D 5/08 (2006.01)
CPC B26D 1/245 (2013.01) [B26D 5/086 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A cutting device comprising:
an upper cutter, and
a lower cutter disposed under the upper cutter, wherein
the upper cutter includes:
an upper head portion movable in a first direction and a second direction;
an upper holder connected to the upper head portion; and
an upper cutting wheel connected to the upper holder,
the upper holder includes:
an upper body portion connected to the upper head portion;
an upper cutting wheel fixing portion rotatable with respect to the upper body portion; and
an upper magnetic portion disposed on sides of the upper cutting wheel fixing portion, and including a magnetic substance, and
the lower cutter includes:
a lower head portion movable in the first direction and the second direction;
a lower holder connected to the lower head portion;
a lower cutting wheel connected to the lower holder; and
an upper holder rotation inducer connected to the lower head portion and including a magnetic substance, wherein
the upper holder rotation inducer includes:
a lower cylinder connected to a first side of the lower head portion;
a lower stage movable in a third direction by the lower cylinder, the third direction being perpendicular to the first direction and the second direction; and
an upper holder rotation inducing magnetic portion disposed on the lower stage.