US 12,083,648 B2
Sandpaper replacement system
Yi-Fam Shiu, Toufen (TW); Cheng-Chao Tsai, Tainan (TW); Cheng-Lung Wu, Zhunan Township (TW); Chih-Hung Huang, Hsinchu (TW); and Jiun-Rong Pai, Jhubei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Aug. 6, 2021, as Appl. No. 17/444,602.
Prior Publication US 2023/0039611 A1, Feb. 9, 2023
Int. Cl. B24B 41/047 (2006.01)
CPC B24B 41/047 (2013.01) 20 Claims
OG exemplary drawing
 
1. A system, comprising:
a loader tool to load a plate to which a sandpaper sheet is to be affixed to a surface of the plate in association with semiconductor processing;
a sandpaper affixing tool to:
remove a liner from the sandpaper sheet to expose an adhesive surface of the sandpaper sheet, and
affix the sandpaper sheet to the surface of the plate using the adhesive surface of the sandpaper sheet;
a flatness detector to determine whether a surface of the sandpaper sheet is sufficiently flat for the semiconductor processing after the sandpaper sheet is affixed to the surface of the plate; and
an unloader tool to store the plate after the sandpaper sheet is affixed to the surface of the plate.