US 12,083,627 B1
Multi-spots soldering method for processing camera and laser radar
Quan Cen, Guangdong (CN); Zengwen Zhang, Guangdong (CN); and Xinjian Li, Guangdong (CN)
Assigned to ShenZhen Rayshine Automation Technology Co., LTD., Guangdong (CN)
Filed by ShenZhen Rayshine Automation Technology Co., LTD., Guangdong (CN)
Filed on Dec. 25, 2023, as Appl. No. 18/395,693.
Claims priority of application No. 202310495923.8 (CN), filed on May 5, 2023.
Int. Cl. B23K 1/00 (2006.01); B23K 3/08 (2006.01); B23K 101/36 (2006.01)
CPC B23K 3/08 (2013.01) [B23K 1/0008 (2013.01); B23K 2101/36 (2018.08)] 10 Claims
OG exemplary drawing
 
1. A multi-spots soldering method, which is applied to a camera or a laser radar, comprising the following steps:
step A1, determining soldering spots to be soldered on the camera or the laser radar;
step A2, performing a solder-control method; and
step A3, performing a soldering energy compensation method;
wherein the determining soldering spots to be soldered comprises providing a plurality of soldering spots between a first soldering component and a second soldering component, virtual lines connected successively between the plurality of soldering spots form a regular polygon, the first soldering component and the second soldering component are concentric to each other, and the plurality of soldering spots are located within a range of the second soldering component;
performing the solder-control method comprises adding an equivalent amount of solder on the plurality of soldering spots according to a preset amount of the solder, and the preset amount of the solder is determined by sizes and surface materials of the first soldering component and the second soldering component; and
performing the soldering energy compensation method comprises detecting energy of the plurality of soldering spots in real time during soldering the plurality of soldering spots simultaneously, comparing detected real-time data of the plurality of soldering spots with the preset amount of the solder; increasing soldering energy to soldering spots of the plurality of soldering spots below the preset amount of the solder when the detected real-time data is less than the preset amount of the solder; and decreasing the soldering energy to soldering spots of the plurality of soldering spots above the preset amount of the solder when the detected real-time data is greater than the preset amount of the solder.