US 11,758,656 B2
Backplane footprint for high speed, high density electrical connectors
Marc B. Cartier, Jr., Durham, NH (US); Mark W. Gailus, Concord, MA (US); Tom Pitten, Merrimack, NH (US); Donald A. Girard, Jr., Bedford, NH (US); and Huilin Ren, Amherst, NH (US)
Assigned to Amphenol Corporation, Wallingford, CT (US)
Filed by Amphenol Corporation, Wallingford, CT (US)
Filed on Jun. 15, 2021, as Appl. No. 17/347,668.
Application 17/347,668 is a division of application No. 16/435,781, filed on Jun. 10, 2019, granted, now 11,057,995.
Claims priority of provisional application 62/683,146, filed on Jun. 11, 2018.
Prior Publication US 2021/0315102 A1, Oct. 7, 2021
Int. Cl. H05K 1/11 (2006.01); H01R 13/66 (2006.01); H05K 1/14 (2006.01)
CPC H05K 1/115 (2013.01) [H01R 13/6658 (2013.01); H05K 1/117 (2013.01); H05K 1/145 (2013.01)] 6 Claims
OG exemplary drawing
1. An interconnection system comprising:
a surface mount component comprising surface mount leads; and
a printed circuit board comprising conductive layers separated by dielectric layers, and vias configured for solder attachment to respective leads of the surface mount component, each of the vias including a conductive element having a recess in an upper surface thereof, wherein the recess in the conductive element is smaller in diameter than a surface mount lead of the surface mount leads and receives only a tip portion of the surface mount lead.