US 11,756,904 B2
Semiconductor device package and method of manufacturing the same
Yuanhao Yu, Kaohsiung (TW); Cheng-Lin Ho, Kaohsiung (TW); Yu-Lin Shih, Kaohsiung (TW); and Shih-Chun Li, Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Jun. 8, 2020, as Appl. No. 16/895,989.
Prior Publication US 2021/0384148 A1, Dec. 9, 2021
Int. Cl. H01L 23/66 (2006.01); H01Q 1/22 (2006.01)
CPC H01L 23/66 (2013.01) [H01Q 1/2283 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01)] 20 Claims
OG exemplary drawing
1. A semiconductor device package, comprising:
a substrate having an upper surface;
a reflector disposed above the upper surface of the substrate;
a radiator disposed above the reflector; and
a first director disposed above the radiator,
wherein the reflector, the radiator, and the first director collectively define an antenna, the reflector, the radiator, and the first director are free from overlapping each other vertically from a cross-sectional view perspective, and a radiation direction of the antenna is non-parallel to the upper surface of the substrate.